Femtosecond lasers extend glass cleaving to mixed materials
Filamentation cutting is a relatively new process that uses ultrashort-pulse (USP) lasers to cut a wide range of glass substrates, from soft borosilicates to chemically hardened glass used in smartphone displays. Among the advantages of filamentation cutting are the ability to produce curved shapes and cut-outs, cutting speeds up to 2000 mm/s, and superior stress-free edge quality, which eliminates the need for post-processing. The high peak intensity created by a focused USP laser produces self-focusing of the beam because of the nonlinear optical Kerr effect, further increasing power density until, at a certain threshold, a low density plasma is created in the material. This plasma lowers the material refractive index in the center of the beam path and causes the beam to defocus. If the beam focusing optics are properly configured, this focusing/defocusing effect can be balanced to periodically repeat and form a stable filament, which extends over several millimeters in depth throu